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Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.Shanghai Headquarters of the Central Bank: The amount of cross-border RMB settlement in Shanghai in November was 2,491.8 billion yuan. According to the news of Shanghai Headquarters of the Central Bank, as of the end of November, there were 102 banks in Shanghai that submitted information on cross-border RMB settlement business, with a settlement amount of 2,491.8 billion yuan in November and a cumulative settlement amount of 27,151.9 billion yuan from January to November.Openai: the downtime failures of API, CHATGPT and SORA have been basically fixed. We are monitoring the situation to ensure that the downtime is fully resolved.

The Thai government plans to launch digital wallet distribution in 2025.Black hand again! The United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products in China from the beginning of next year. The Office of the US Trade Representative issued a statement saying that the United States will raise import tariffs on solar polysilicon, silicon wafers and some tungsten products imported from China from the beginning of next year after a four-year review by the Biden administration. The tariff rate of silicon wafer and polysilicon will be increased to 50%, and the tariff rate of some tungsten products will be increased to 25%. These tariff increases will take effect on January 1, 2025. (Cailian)The opposition party in South Korea said that Yin Xiyue was insane. On the morning of December 12, local time, South Korean President Yin Xiyue made another televised speech, refused to step down early, and denied that martial law was a crime of civil strife. After Yin Xiyue's speech, public opinion in South Korea immediately criticized him. South Korea's largest opposition party, the Common Democratic Party, said that Yin Xiyue was mentally ill and called on the South Korean National Assembly to pass the impeachment case. After Yin Xiyue's speech, Han Dongxun, the representative of the ruling party in South Korea, also said that Yin Xiyue's speech had no introspection and was rationalizing his behavior. Some commentators pointed out that Yin Xiyue may have expected that he could not prevent the National Assembly from passing the impeachment case and was trying to influence the final ruling of the Constitutional Court. I am afraid that the chaos in Korean politics will continue.

Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)The securities sector continued to rise, and Guolian Securities closed the daily limit. Prior to this, Guosheng Financial Holdings had three consecutive boards, and Harbin Investment, Southwest Securities, Huaxin Shares and Cinda Securities followed suit.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)